HFET Amplifiers for High Linearity Applications

Abstract:
GaAs HFET technology has been established for decades and in most applications has been replaced by GaAs pHEMT processes. However, for high linearity applications HFET technology still provides a level of performance that is unable to be replicated by other GaAs technologies. CML Micro offers HFET C-band amplifiers for communications and radar applications where IP3 and AM-PM performance is critical. In this presentation the performance of CML Micro’s HFET amplifiers will be outlined and the importance of high linearity to end customers will be discussed.

Bio:
Dr. Robert Smith is Product Line Director for RF and mmWave Compound Semiconductor products at CML Micro. His role includes overseeing the design of mmWave GaN power amplifiers, broadband MMICs, LNAs and RF switches. His experience encompasses designing on GaAs and GaN processes at Qorvo, Wolfspeed and WIN Semiconductors. Before joining PRFI, Robert designed transmitter modules for active phased array radar.

He received a Ph.D. in microwave engineering from Cardiff University, where he specialised in broadband power amplifier design. Robert is a reviewer for IEEE Microwave and Wireless Component Letters, has written multiple conference and industrial journal papers and is on the Editorial Review Board for Microwave Journal. He received his MBA in Technology Management in 2023.

High-Frequency, High-Performance, High-Power: Unlocking the Next Generation of Satellite Gateway Throughput

Abstract:
The rapid expansion of low earth orbit and medium earth orbit constellations is leading to an ever-increasing demand for satellite ground station gateways and uplink bandwidth. Increasing the uplink bandwidth requires use of higher frequencies like V band (47.2-52.4GHz) while maintaining the necessary high performance requires high power levels. Until now this would have required a relatively unreliable travelling wave tube amplifier. However, Filtronic have designed a solid-state high-power amplifier based on combining the output of 128 GaN power amplifiers driven from in-house developed broadband upconverters capable of translating 2-4GHz of bandwidth from an IF to V band. The challenges of designing the power amplifier, and the design of the broadband upconverter will be explored.

Bio:
Amin is a Senior RF Engineer at Filtronic, who is responsible for the full design and development of RF/mmWave (Ka and Q/V band) sub-circuits, sub-modules, and systems for telecommunications and defence products. Bringing over 15 years of experience in developing Ku- and Ka-band products and prototypes for satellite communications and radar applications. At Global Invacom in Stevenage, led the design of Ka-band transceivers and RF over fibre products. At University College London, contributed to various funded projects, primarily for radar applications in the UHF and Ku bands.

‘Made in Space‘

Abstract:
For over 50 years, state funded space agencies have conducted experiments on crystal growth in space, encompassing pharmaceuticals, alloys and semiconductors. The trend observed and summarized in the NASA/Butler University study of >160 in-space inorganic semiconductor crystal growth experiments show that manufacturing in low earth orbit (LEO) can transform quality through consistent improvements in size, purity and crystalline structure over those grown terrestrially.

Space Forge was founded in 2018 with the aim of realising the commercial opportunity of growing semiconductor materials in space for terrestrial applications. As such it is a global first mover in the pursuit of developing a commercial in-space manufacturing (ISM) capability and realising its economic benefits. With the increasing geo-political tensions particularly regarding semiconductors and their supply chains, in 2024 Space Forge secured its Series A investment that was led by the NATO Innovation Fund.

This paper will present the approach Space Forge is taking to develop these materials for terrestrial use, the drivers for such materials, and the challenges associated both in terms of business model and technology adoption and integration.

Bio:
Darren has over 25 years experience within the electronics manufacturing, semiconductor and RF industry. During that time he has been involved with the full range of technology maturity levels, from fundamental research through to volume production. He is currently Business and Bid development Manager at Space Forge, developing its semiconductor activities.

Industry Trends and Challenges for MM-Wave MMIC Design

Abstract:
Recent spectrum allocations by FCC amongst others are opening up the mm-wave, sub THz bands for commercial exploitation. Typically, we think of mm-wave as 30 GHz – 300 GHz, applications cited are 6G, variety of short-range radar systems, drivers for optical communications especially for data centres, and sat comms. To build these systems we require MMICs operating at these sub-THz frequencies which in turn, presuming the semiconductor processes exist, requires good device models and EM modelling of chips, fabrication structures and systems. This talk will touch upon available processes and the challenges in acquiring good device measurement data and will describe the equipment required

Bio:
Rob Sloan, Founder and CEO of Microwave Inspection Technologies Ltd, is also a Visiting Professor of Millimetre-wave Electronics at the University of Manchester, where he was an academic for 23 Years (1994 – 2017).  He has published over 100 technical papers in refereed journals and conferences. From 2009 – 2017, he was a Visiting Professor at Keysight Technologies, Santa Rosa, USA where he researched broadband millimetre-wave components for future vector network analyser families. From 2017 – 2020 he was Principal Analogue IC Design Engineer at Semtech EMEA Ltd.

Rob Sloan is a member Royal Society Industrial Fellow College, a Senior Member of IEEE, Chartered Engineer and Fellow of the IET. He is a Member of British Institute of NDT (BINDT), a Member of the American Society for Non-Destructive Test (ASNT) and a founding member of the ASNT Microwave Methods Committee, which is currently developing the ASNT SNT-TC 1A/CP-105 microwave inspection standard and training requirements.

The Upcoming Major Evolution in Cellular Infrastructure Design and the Great Opportunity for GaN on Silicon

Abstract:
This talk will discuss the evolution in requirements for next generation infrastructure as we move towards 6G and Massive MIMO architectures and how this impacts the front-end technology choices. The best in class PA performance levels of GaN will need to carry over into the new frequency bands whilst also meeting the integration, cost and power level requirements for this new generation of equipment

Bio:
To be updated

MEMS-Based Phased Arrays for Satcom and Radar Applications

Abstract:
Electronically scanned arrays have shown great promise for a broad range of communications systems. The wide adoption of this technology has largely been limited by power consumption and heat dissipation requirements of these solutions. MEMS-based phased array technology represents a paradigm shift in beamforming and power consumption. This presentation explores the design, functionality, and applications of micro-electromechanical systems (MEMS) for phased arrays, describing their ability to overcome traditional limitations in size, weight, and power (SWaP).

We will demonstrate how using MEMS technology can deliver highly compact and energy-efficient solutions that address the critical demands of SWaP-sensitive applications. These advancements make them ideal for next-generation satellite communications and advanced radar systems, where size, weight, and power are key performance factors.

The presentation will highlight key technical advancements, including the size reduction of antenna systems and the reduced power consumption, both enabled by MEMS integration. With real-world examples and case studies, it will explain how MEMS based phased arrays can transform industries and enable smarter, more connected systems. Attendees will gain a deeper understanding of MEMS-based phased arrays’ potential to revolutionize communication infrastructure and drive innovation across multiple sectors.

Bio:
Andrew is a seasoned technology leader with over 30 years of expertise in RF design for communications systems, RFICs, and Antennas. As the Vice President of Engineering at Sofant for 7 years, he drives technology and product development, contributing to the company’s innovative growth. Andrew has a proven track record in leading startups as well as senior roles at RFMD (now Qorvo) and pSemi. He excels at bringing early-stage RF technologies to market and is dedicated to advancing the world of RF technology and communications.

Introduction to Octric – a UK Microwave Compound Semiconductor Fab

Abstract:
The talk will introduce Octric, a recently formed company whose mission is to provide a UK manufacturing capability in microwave semiconductors. A brief history of the facility will be given that illustrates the range of activities undertaken in the facility and the journey that led to its purchase by the UK MOD in order to secure a strategic sovereign capability required by UK defence. The talk will then describe the company’s current capabilities and development plans in both GaAs and GaN MMIC technologies.

Bio:
Dr Rob Davis is the CTO of Octric Compound Semiconductors Ltd located in County Durham, UK. He has 40 years experience in microwave compound semiconductor electronics. Rob has a degree in Physics and a PhD in millimetre-wave electronics from Lancaster University. He started his career at the Royal Signals and Radar Establishment in the mid-80’s when MMICs were in their infancy. He moved to Filtronic Compound Semiconductors in 2000 where he led the company’s device engineering activities. He has since remained at this facility through a series of owners including RFMD (now Qorvo) and Coherent Inc. which provided the opportunity to work on a variety of electronic and photonic technologies. More recently the factory was purchased by the UK MOD in order to secure a UK Sovereign source of microwave GaAs and GaN device technologies. Here Rob leads Octric’s technology development activities and associated engineering teams.

Novel Gasket and Absorber Techniques for the Design of Compact High-Performance Repeatable RF Systems

Abstract:
Recent developments in RF and Microwave technology have put a particular emphasis on high levels of integration, and dense physical layout, which result in significant design challenges to obtain isolation and thus optimal RF performance. This presentation will discuss EECL’s RF shielding gasket and absorber dispensing technology, which allows for precise, repeatable, automated application of shielding materials in complex RF and microwave enclosures. The internally developed gasket and absorber chemistry achieve optimal RF performance from DC to 100GHz, and are specially designed for automated dispensing which in turn lends the technology to large volume applications, and large-scale commercialization, which is offered as a service by EECL.

The presentation will also highlight real-life case studies on achieved performance of the gasket and absorber technology. Presented examples will include a 30GHz Switch Matrix, where upward of 100 dB isolation port-to-port isolation is achieved, as well as a Ka-Band 16-channel beamformer, and W-Band (71-86GHz) frequency converter. These case studies will demonstrate that the gasket and absorber technology allow for superior isolation, gain flatness, and other key RF performance parameters, and full removal of self-oscillations due to cavity-resonant modes, while maintaining maximal integration density.

Bio:
Dr. Ben Kieniewicz is the Founder and CEO of EECL, a company he established in 2016 to advance novel RF design and manufacturing technologies. Prior to founding EECL, he held positions at BAE Systems, Teledyne Defence, and Surrey Satellite Technology Ltd (SSTL), where he contributed to the development of various RF space payloads. Under his leadership, EECL has designed, built, and delivered more than 20 space payloads for organizations including ESA, SSTL, and DLR, and is preparing to send a GPS receiver to the Moon in 2026. Focused on RF and microwave technologies, EECL has successfully completed over 50 complex projects and grown to a team of more than 10 specialists.